Low-Pressure Molding

Low Pressure Molding

Electronic Encapsulation

Our Low Pressure Molding technology was initially used in the automotive industry to waterproof connectors and to add effective strain relief for wires and cables.
Low Pressure Molding is now used to provide electronics encapsulation for:

  • Automotive products
  • Consumer products
  • Industrial products
  • Medical products
  • Military products

The common denominator for these industries is a need to protect electronics and/or to create effective strain relief.

Low Pressure Molding with Macromelt® Polyamide Thermoplastic

Low Pressure Molding (LPM) is often used instead of potting (typically where a 2-part potting resin is dispensed onto electronics, and the potting material is contained by an additional housing). LPM is a very stable and precise process when compared to potting. We use Macromelt® Polyamide thermoplastic materials for our LPM process. In many applications, the molding material actually becomes the housing.

The Low Pressure Molding Difference

The process: Low Pressure Molding is primarily an encapsulation process for electronic assemblies. In some ways LPM is similar to traditional plastic injection molding.

Low Pressure Molding differs from traditional plastic injection molding in two main areas:

  1. The type of molding materials used. High performance Polyamide and Polyolefin based adhesives are used for our LPM process.
  2. The low injection pressure: The molding compounds are heated to have viscosity of only a few thousand cP. This allows injection into the mold-set cavities at pressures as low as 25 psi. This results in a very gentle encapsulation of fragile components.