Cavist Manufacturing and Overmolding Materials
Cavist uses a variety of over-molding materials depending on what is best suited for each application. Polyamide Adhesive Thermoplastics allow for low pressure molding in any shape around electronics, cables and pcbs. In addition, Epoxy potting, RTV Silicone and TPU (Thermoplastic Polyurethane) are used appropriately as an application may dictate.
Cavist uses a branded polyamide adhesive thermoplastic called Technomelt® developed by the Henkel Corporation. Technomelt® offers a superior seal and has been used to over-mold electronics for over twenty years. The Technomelt® product selector below is provided as a general guide for typical material applications.