Menu
Materials
The right materials for the right applications.
Low Pressure Molding Materials
Henkel Technomelt® PA Series Polyamides
Our Low Pressure Molding process uses Henkel Technomelt® PA Series Polyamides, high-performance thermoplastics that can be processed at low processing pressure due to their low viscosity, allowing encapsulation of fragile components without damage.
Polyamide | High Temperature Resistance
Moldable polyamide with good adhesion for higher temperature applications such as automotive under-hood.
Polyamides | Good Adhesion to Various Substrates
Moldable polyamide with good adhesion properties and high temperature capability.
Polyamides | Excellent Adhesion to Various Substrates
Moldable polyamide with excellent adhesion to multiple substrates. Offers excellent flexibility for use in strain relief applications. UL RTI 95° C
Polyamides | Increased Hardness
Moldable polyamide with good strength and hardness for applications that require durability and impact resistance.
Polyamides | UV Exposure
Moldable polyamide material with outstanding adhesion properties to various substrates. UV resistance allows for use in outdoor applications.
| Product | Color | Performance Temp. | Shore A Hardness | Softening Point | Data Sheet |
|---|---|---|---|---|---|
|
PA 6344 |
Black |
-40 to 100° C |
76 |
146° C |
2-Shot Molding Materials
TPE, TPU, Silicone, and more.
Some applications simply demand more. Conventional injection molding resins like TPU or Nylon cannot be processed directly over electronic devices because the processing pressure would destroy the components. Our 2-shot process uses low pressure molding to safely encapsulate the device, along with a second shot of engineering thermoplastics to provide increased strength or chemical resistance. Call or email to learn more about the material options.
Let’s see if we’re a good fit.
CAVIST
9290 Prototype Drive | Reno, Nevada 89521 USA | 775.332.8400
All content © Copyright 2021 Cavist. Design © Copyright Design Factor. All rights Reserved.