We’ve taken transfer molding technology, a manufacturing process where casting material is forced into a mold, and adapted it for packaging electronic assemblies at the board level. Using the same process from IC encapsulation, any printed circuit board assembly (PCBA) can be inserted into the mold and encapsulated with extremely robust Epoxy Molding Compounds (EMCs), eliminating the air bubbles and entrapment that often happens with a sloppy, self-leveling potting application.
The most noticeable difference between this new approach and traditional epoxy potting is the immediate realization of weight and material savings by conformal contouring of the PCBA and its components, eliminating the use of unnecessary bulk material. The result is thin, strong, streamlined encapsulation, reduced material weight, material savings, and you guessed it, cost savings.